2011 Ford Edge SEL - FDIM - Front Display Interface Module (BT4T-18B955-AC) 
Teardown Analysis - 2011 Ford Edge SEL - FDIM - Front Display Interface Module (BT4T-18B955-AC) 
In the first comprehensive teardown of a vehicle and its electronic systems, the IHS iSuppli Teardown Analysis team at information and analysis provider IHS is launching a major dissection of the 2011 Edge sport utility vehicle from the Ford Motor Co., the best-selling SUV in September from the venerable car manufacturer.
The complete analysis will offer a detailed breakdown of the electronic modules in the engine, infotainment, cabin and body, including such modules as Ford’s noted SYNC communications and entertainment system. The Edge vehicle dissection will include an exhaustive bill of materials, accompanied by interactive cost tables and multiple summary analyses—all of which will provide buyers of the teardown report with the maximum flexibility in order to review and utilize the valuable data being disclosed…

2011 Ford Edge Teardown Analysis

Key Issues Addressed
  • How competitive are our designs from a technical perspective?
  • Where does our competition stand in terms of design sophistication?
  • Are our costs in line with those of our competitors?
  • How much does it cost our competitors to add certain product features?
  • How can we better position and differentiate our products?
  • What new or evolving solutions could we use in future designs that will increase performance and save money?
Applicable To
  • OEMs
    • Market Research Managers
    • Product Marketing Managers
    • Design / Technical Managers
    • Purchasing Management
  • Component Manufacturers
    • Product Marketing Managers
    • Market Research Managers
  • Service Providers
    • Purchasing Management
Deliverables
  • Summary Analysis
    • Commentary for Specific Assembly Levels
    • Component Cost Tables and Graphical Representation
    • Downloadable BOM Files
  • Photo Analysis  
    • Block Diagrams / Functional Analysis
    • IC - Die Photos and Markings
    • Major Components
    • Sub-Assemblies

IHS iSuppli's market intelligence helps technology companies achieve market leadership. Catch the latest bill of materials, teardown, teardown analysis, BOM cost from all across the world straight from our immensely experienced analysts. iSuppli provides comprehensive IHS iSuppli® Teardown analysis service provides access to complete bill of materials, cost model & component pricing. To learn more, call us at 1-310-524-4007. for new and upcoming devices in the market. To know more, send us an e-mail on info@isuppli.com or contact us on +1.310.524.4007.