HTC Evo - Sprint's First 4G (WiMax) Mobile Handset  
Teardown Analysis - HTC Evo 4G Mobile Handset 

What’s inside the HTC EVO 4G? iSuppli’s Teardown Analysis Service found a similar 1GHz Qualcomm Snapdragon baseband processor as in the recently analyzed HTC Incredible, an oversized 4.3-inch capacitive touch screen display and a brand new WiMax mobile chipset from Sequans Communications...

Now Includes Software Analysis
The software cost analysis from iSuppli provides an in-depth accounting of the 'soft costs' involved in the development and deployment of advanced smart phones. This service (in conjunction with our traditional hardware teardown service) aims to provided the most complete picture of the entire Cost of Good Sold (COGS) of a handset; highlighting the major software components, operating system as well as royalty charges that can be attributed to each individual production unit providing you a better understanding of device software cost contributions.

HTC EVO 4G Teardown

Key Issues Addressed
  • How competitive are our designs from a technical perspective?
  • Where does our competition stand in terms of design sophistication?
  • Are our costs in line with those of our competitors?
  • How much does it cost our competitors to add certain product features?
  • How can we better position and differentiate our products?
  • What new or evolving solutions could we use in future designs that will increase performance and save money?
Applicable To
  • OEMs
    • Market Research Managers
    • Product Marketing Managers
    • Design / Technical Managers
    • Purchasing Management
  • Component Manufacturers
    • Product Marketing Managers
    • Market Research Managers
  • Service Providers
    • Purchasing Management
Deliverables
  • Summary Analysis
    • Commentary for Specific Assembly Levels
    • Component Cost Tables and Graphical Representation
    • Downloadable BOM Files
  • Photo Analysis  
    • Block Diagrams / Functional Analysis
    • IC - Die Photos and Markings
    • Major Components
    • Sub-Assemblies

IHS iSuppli's market intelligence helps technology companies achieve market leadership. Catch the latest teardown reports from all across the world straight from our immensely experienced analysts. The Teardowns portal at iSuppli provides deeper insights into bill of Materials (BOM), photo analysis, component cost tables and graphical representation of mobile handsets, personal and home entertainment electronics, and computers and data communication devices. iSuppli provides comprehensive teardowns for new and upcoming devices in the market. To know more, send us an e-mail on info@isuppli.com or contact us on +1.310.524.4007.